Invention Grant
- Patent Title: Module, and server
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Application No.: US16756795Application Date: 2018-07-24
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Publication No.: US11246242B2Publication Date: 2022-02-08
- Inventor: Syoji Ochiai
- Applicant: NEC Platforms, Ltd.
- Applicant Address: JP Kawasaki
- Assignee: NEC Platforms, Ltd.
- Current Assignee: NEC Platforms, Ltd.
- Current Assignee Address: JP Kawasaki
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-203289 20171020
- International Application: PCT/JP2018/027736 WO 20180724
- International Announcement: WO2019/077827 WO 20190425
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.
Public/Granted literature
- US20210195805A1 MODULE, AND SERVER Public/Granted day:2021-06-24
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