Invention Grant
- Patent Title: Packing material for HILIC columns, HILIC column filled with same, and method for analyzing oligosaccharide with use of same
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Application No.: US16327437Application Date: 2017-08-10
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Publication No.: US11247192B2Publication Date: 2022-02-15
- Inventor: Junya Kato , Hideyuki Kondo , Ryuji Takahashi
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2016-165907 20160826
- International Application: PCT/JP2017/029118 WO 20170810
- International Announcement: WO2018/037940 WO 20180301
- Main IPC: B01J20/26
- IPC: B01J20/26 ; G01N30/88 ; B01D15/38 ; B01D15/00 ; B01J20/28 ; B01D15/42 ; B01J20/281 ; B01J20/285
Abstract:
Provided is a packing material for HILIC columns for more accurately and more easily performing oligosaccharide analysis by liquid chromatography; an HILIC column which is filled with the packing material for HILIC columns; and a method for analyzing an oligosaccharide with use of this packing material for HILIC columns A packing material for HILIC columns according to the present invention is composed of particles, each of which is obtained by reacting glycidol to a hydroxyl group of a porous cross-linked polymer base material having the hydroxyl group, and which have a hydrophilicity index of 2.30 or more and a surface-pH index of from 0.95 to 1.05.
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