Invention Grant
- Patent Title: Hard-mask forming composition and method for manufacturing electronic component
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Application No.: US16387164Application Date: 2019-04-17
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Publication No.: US11248086B2Publication Date: 2022-02-15
- Inventor: Keiichi Ibata , Ryoji Watanabe
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JPJP2018-088421 20180501
- Main IPC: C08G61/12
- IPC: C08G61/12 ; G03F7/004 ; C08L61/06 ; C08G8/04 ; C08G16/02 ; C08L61/34 ; G03F7/075 ; G03F7/09 ; H01L21/02 ; H01L21/033
Abstract:
A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.
Public/Granted literature
- US20190341253A1 HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2019-11-07
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