Invention Grant
- Patent Title: Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet
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Application No.: US15764971Application Date: 2016-10-06
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Publication No.: US11248149B2Publication Date: 2022-02-15
- Inventor: Juichi Fukatani , Kiyomi Uenomachi , Takazumi Okabayashi , Ryousuke Ebina , Atsushi Wada
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2015-199737 20151007
- International Application: PCT/JP2016/079804 WO 20161006
- International Announcement: WO2017/061547 WO 20170413
- Main IPC: C09J129/14
- IPC: C09J129/14 ; C09J7/10 ; C09J7/30 ; C09J4/00 ; C08L29/14 ; C08F116/38 ; C08K5/101 ; C08K5/1515 ; C08K5/07 ; C08K5/00 ; B29K105/00

Abstract:
The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×104 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×103 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.
Public/Granted literature
- US20180258326A1 POLYVINYL ACETAL RESIN COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING ADHESIVE SHEET Public/Granted day:2018-09-13
Information query
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