Invention Grant
- Patent Title: Thermoconductive silicone composition
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Application No.: US16342785Application Date: 2017-10-05
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Publication No.: US11248154B2Publication Date: 2022-02-15
- Inventor: Yasuhisa Ishihara , Akihiro Endo
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-204276 20161018
- International Application: PCT/JP2017/036305 WO 20171005
- International Announcement: WO2018/074247 WO 20180426
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08G77/04 ; C08K3/22 ; C08K3/28 ; C08K7/18 ; C08L83/04 ; C08K13/04 ; C08K3/013 ; C08K13/00
Abstract:
A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.
Public/Granted literature
- US20190256756A1 THERMOCONDUCTIVE SILICONE COMPOSITION Public/Granted day:2019-08-22
Information query
