Invention Grant
- Patent Title: Gas heat-pump system
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Application No.: US17111697Application Date: 2020-12-04
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Publication No.: US11248544B2Publication Date: 2022-02-15
- Inventor: Heejoong Jang , Hojong Jeong
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2019-0161650 20191206
- Main IPC: F02D41/00
- IPC: F02D41/00 ; F02D41/14 ; F02B37/12
Abstract:
Proposed is a gas heat-pump system capable of supplying recirculation exhaust gas using a motor-driven turbocharger and thus actively controlling an amount of flowing recirculation exhaust gas and pressure thereof.
Public/Granted literature
- US20210172392A1 GAS HEAT-PUMP SYSTEM Public/Granted day:2021-06-10
Information query
