- Patent Title: Thin-section preparation method and thin-section preparation device
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Application No.: US14441384Application Date: 2013-11-06
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Publication No.: US11248991B2Publication Date: 2022-02-15
- Inventor: Jyunya Enomoto
- Applicant: SAKURA FINETEK JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee: SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Priority: JPJP2012-246338 20121108
- International Application: PCT/JP2013/080008 WO 20131106
- International Announcement: WO2014/073564 WO 20140515
- Main IPC: G01N1/06
- IPC: G01N1/06 ; B26D3/28 ; B26D5/00 ; B26D7/26

Abstract:
A thin-section preparation method and device includes, in a one-blade set state where an entire first cutting blade is held by a holder, performing a first rough cutting step of rough cutting an embedded block using a first end region of the first cutting blade, and a first main cutting step of main cutting the embedded block using a second end region of the first cutting blade; and further includes, in a two-blade set state where the second end region of the first cutting blade and a first end region of a second cutting blade are held by the holder, performing a second rough cutting step of rough cutting the embedded block using the second end region of the first cutting blade, and a second main cutting step of main cutting the embedded block using the first end region of the second cutting blade.
Public/Granted literature
- US20150300925A1 THIN-SECTION PREPARATION METHOD AND THIN-SECTION PREPARATION DEVICE Public/Granted day:2015-10-22
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