Invention Grant
- Patent Title: White LED package, light-emitting device, surface light source device and display device
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Application No.: US17361416Application Date: 2021-06-29
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Publication No.: US11249345B2Publication Date: 2022-02-15
- Inventor: Yuki Fujii
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Priority: JPJP2020-113033 20200630
- Main IPC: G02F1/1335
- IPC: G02F1/1335 ; H01L25/075 ; G02F1/13357 ; H01L33/58 ; H01L33/50

Abstract:
Condition 1 (an absolute value of a difference between IB×B and EB×B is 55% or smaller) and condition 2 (an absolute value of a difference between IY×Y and EY×Y is 55% or smaller) are satisfied, where, when an area of the light-emitting surface is equally divided into inner and outer regions by a boundary line as an outer edge of a region similar in shape to the light-emitting surface in plan view of a white LED package, IB (%) is an area ratio of blue LED chips in the inner region; IY (%) is an area ratio of the region where no blue LED chips is disposed in the inner region; EB (%) is an area ratio of the blue LED chips in the outer region; and EY (%) is an area ratio of the region where no blue LED chip is disposed in the outer region.
Public/Granted literature
- US20210405453A1 WHITE LED PACKAGE, LIGHT-EMITTING DEVICE, SURFACE LIGHT SOURCE DEVICE AND DISPLAY DEVICE Public/Granted day:2021-12-30
Information query
IPC分类: