Invention Grant
- Patent Title: Resist underlayer composition, and method of forming patterns using the composition
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Application No.: US16789233Application Date: 2020-02-12
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Publication No.: US11249396B2Publication Date: 2022-02-15
- Inventor: Hyeon Park , Yoojeong Choi , Soonhyung Kwon , Shinhyo Bae , Jaeyeol Baek
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2019-0025943 20190306
- Main IPC: G03F7/11
- IPC: G03F7/11 ; G03F7/004 ; C08G73/06 ; C08G18/79 ; G03F7/16
Abstract:
A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1; and a solvent and a method of forming patterns using the resist underlayer composition: In Chemical Formula 1, at least one of A1 and A2 is a group represented by Chemical Formula A:
Public/Granted literature
- US20200285153A1 RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION Public/Granted day:2020-09-10
Information query
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