Invention Grant
- Patent Title: Firmware component with self-descriptive dependency information
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Application No.: US16649911Application Date: 2017-09-27
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Publication No.: US11249748B2Publication Date: 2022-02-15
- Inventor: Vincent Zimmer , Jiewen Yao
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- International Application: PCT/CN2017/103642 WO 20170927
- International Announcement: WO2019/061067 WO 20190404
- Main IPC: G06F8/71
- IPC: G06F8/71 ; G06F8/65
Abstract:
An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20200310788A1 FIRMWARE COMPONENT WITH SELF-DESCRIPTIVE DEPENDENCY INFORMATION Public/Granted day:2020-10-01
Information query
