Invention Grant
- Patent Title: Thermal processing method and thermal processing device
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Application No.: US16960923Application Date: 2018-10-03
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Publication No.: US11251057B2Publication Date: 2022-02-15
- Inventor: Yukio Ono
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2018-011269 20180126
- International Application: PCT/JP2018/037010 WO 20181003
- International Announcement: WO2019/146166 WO 20190801
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/268 ; H01L21/324

Abstract:
Before a start of a treatment of a semiconductor wafer to be treated first in a lot, a dummy wafer is transported into a chamber, and an atmosphere including a helium gas having high thermal conductivity is formed. When the dummy wafer is heated with light irradiation from halogen lamps, heat transfer from the dummy wafer the temperature of which has increased occurs at an upper chamber window and a lower chamber window, with the helium gas as a heating medium. At the time when the semiconductor wafer to be treated first is transported into the chamber, the upper chamber window and the lower chamber window are heated, which makes a temperature history of all the semiconductor wafers in the lot uniform. It is thus possible to omit dummy running.
Public/Granted literature
- US20200335366A1 THERMAL PROCESSING METHOD AND THERMAL PROCESSING DEVICE Public/Granted day:2020-10-22
Information query
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