• Patent Title: Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
  • Application No.: US16975218
    Application Date: 2018-04-19
  • Publication No.: US11251153B2
    Publication Date: 2022-02-15
  • Inventor: Jun ChibaYuki AntokuShota Kawano
  • Applicant: TANAKA DENSHI KOGYO K.K.
  • Applicant Address: JP Saga-ken
  • Assignee: TANAKA DENSHI KOGYO K.K.
  • Current Assignee: TANAKA DENSHI KOGYO K.K.
  • Current Assignee Address: JP Saga-ken
  • Agent Manabu Kanesaka
  • Priority: JPJP2018-070813 20180402
  • International Application: PCT/JP2018/016201 WO 20180419
  • International Announcement: WO2019/193771 WO 20191010
  • Main IPC: H01L23/00
  • IPC: H01L23/00 H01L23/495
Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
Abstract:
A noble metal-coated silver bonding wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is not less than 0.01 mass % and not more than 5.0 mass %, and the total sulfur group element content relative to the entire wire is not less than 0.1 mass ppm and not more than 100 mass ppm.
Information query
Patent Agency Ranking
0/0