Invention Grant
- Patent Title: Power semiconductor device
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Application No.: US16771691Application Date: 2018-12-18
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Publication No.: US11251282B2Publication Date: 2022-02-15
- Inventor: Tatsuro Watahiki , Yohei Yuda
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2018-022222 20180209
- International Application: PCT/JP2018/046578 WO 20181218
- International Announcement: WO2019/155768 WO 20190815
- Main IPC: H01L29/47
- IPC: H01L29/47 ; H01L29/06 ; H01L29/24 ; H01L29/40 ; H01L29/66 ; H01L29/872

Abstract:
In order to provide a power semiconductor device reducing a leakage current due to a defect layer and having a small fluctuation in a threshold voltage, included are an n-type epitaxial film layer formed on a surface of the single crystal n-type semiconductor substrate and having a concave portion and a convex portion; an insulating film formed on a first region in a top portion of the convex portion; a p-type thin film layer formed on a surface of the insulating film and a surface of the n-type epitaxial film layer to form a pn junction between the p-type thin film layer and the n-type epitaxial film layer; and an anode electrode, at least part of which is formed on a surface of the p-type thin film layer and part of which passes through the p-type thin film layer and the insulating film.
Public/Granted literature
- US20210074826A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2021-03-11
Information query
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