An insulation film peeling method which radiates laser light onto a front end portion of an insulation film-coated conducting wire including a conducting wire and an insulation film in a longitudinal direction, and which peels a part of the insulation film up to a peeling boundary of a predetermined regulated peeling length, includes performing a rectilinear scan of a first region, in which a radiation position of the laser light moves from one side toward the other side and then moves from the other side toward the one side upon reaching the other side, and performing a unidirectional scan of a second region, in which the radiation of the laser light is performed from one side toward the other side and then the radiation position returns to the one side in a state in which the radiation of the laser light stops upon reaching the other side.