A high-frequency front-end circuit includes a plurality of power amplifiers. Power supply inductors and matching inductors for the power amplifiers are formed of conductors disposed on a substrate. The power supply inductors and the matching inductors are disposed on or in different layers. When the substrate is seen in a plan view, at least a portion of the first power supply inductor and at least a portion of the second matching inductor overlap each other with an insulating layer interposed therebetween.