Invention Grant
- Patent Title: Impedance matching device and impedance matching method
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Application No.: US17197494Application Date: 2021-03-10
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Publication No.: US11251778B2Publication Date: 2022-02-15
- Inventor: Tatsuya Morii
- Applicant: DAIHEN Corporation
- Applicant Address: JP Osaka
- Assignee: DAIHEN Corporation
- Current Assignee: DAIHEN Corporation
- Current Assignee Address: JP Osaka
- Agency: Bozicevic, Field & Francis LLP
- Agent Bret E. Field
- Priority: JPJP2018-245076 20181227
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H11/30

Abstract:
An impedance matching device includes: a variable capacitor in which a plurality of series circuits of capacitors and semiconductor switches are connected in parallel; a calculation unit that calculates an impedance or a reflection coefficient on the load side using information regarding impedance acquired from the outside; and a control unit that determines ON/OFF states to be taken by the semiconductor switches included in the variable capacitor using the impedance or the reflection coefficient calculated by the calculation unit and turns on or off the semiconductor switches based on the determined states. The control unit changes an ON/OFF control timing between one and another of the semiconductor switches.
Public/Granted literature
- US20210194462A1 Impedance Matching Device and Impedance Matching Method Public/Granted day:2021-06-24
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