Disclosed are a method for fabricating a printed circuit board wherein through-holes are formed in an organic substrate, followed by forming micro-circuit patterns through sputtering and plating, whereby the printed circuit board has low permittivity properties and enables high-speed processing, and a printed circuit board fabricated thereby. The disclosed method for fabricating a printed circuit board comprises the steps of: preparing a base substrate; forming a through-hole perforating the base substrate; forming a thin seed layer on the base substrate and in the through-hole; forming a thin plate layer on the thin seed layer; and etching the thin seed layer and the thin plate layer to form a micro-circuit pattern, wherein the base substrate is one selected from an organic substrate, FR-4, and Prepreg.