Invention Grant
- Patent Title: Absolute and differential pressure sensors and related methods
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Application No.: US16718997Application Date: 2019-12-18
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Publication No.: US11254565B2Publication Date: 2022-02-22
- Inventor: Michael J. Seddon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: B81B7/00
- IPC: B81B7/00 ; G01L19/00 ; B81C1/00 ; B81B3/00 ; G01L9/00 ; G01L13/02 ; G01L9/06

Abstract:
Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.
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