Invention Grant
- Patent Title: Resin composition, formed article, and film
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Application No.: US16649057Application Date: 2018-09-06
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Publication No.: US11254818B2Publication Date: 2022-02-22
- Inventor: Takanori Miyabe , Takafumi Oda , Kazuya Sato
- Applicant: Mitsubishi Gas Chemical Company, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: JPJP2017-181922 20170922
- International Application: PCT/JP2018/033049 WO 20180906
- International Announcement: WO2019/058986 WO 20190328
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08J5/18 ; C08L77/10

Abstract:
A resin composition which has oxygen-barrier properties less apt to depend on humidity and has high transparency; and a formed article and a film which include the resin composition are provided. The resin composition includes from 10 to 90 parts by mass of a polyamide resin (A) and from 90 to 10 parts by mass of a polyamide resin (B), wherein the polyamide resin (A) includes constituent units derived from a diamine and constituent units derived from a dicarboxylic acid, with 70 mol % or more of the constituent units derived from a diamine being derived from xylylenediamine and 90 mol % or more of the constituent units derived from a dicarboxylic acid being derived from adipic acid; the polyamide resin (B) includes constituent units derived from a diamine and constituent units derived from a dicarboxylic acid, 70 mol % or more of the constituent units derived from a diamine being derived from xylylenediamine, from 30 to 65 mol % of the constituent units derived from a dicarboxylic acid being derived from an α,ω-linear chain aliphatic dicarboxylic acid having from 4 to 20 carbons, and from 70 to 35 mol % of the constituent units derived from a dicarboxylic acid being derived from isophthalic acid.
Public/Granted literature
- US20200270453A1 RESIN COMPOSITION, FORMED ARTICLE, AND FILM Public/Granted day:2020-08-27
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