Invention Grant
- Patent Title: Heat dissipation structure for lamp and LED lamp
-
Application No.: US17130524Application Date: 2020-12-22
-
Publication No.: US11255492B2Publication Date: 2022-02-22
- Inventor: Chuan Hu , Yinfei Yu , Wangbosheng Wu
- Applicant: OPPLE LIGHTING CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: OPPLE LIGHTING CO., LTD.
- Current Assignee: OPPLE LIGHTING CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Arch & Lake LLP
- Priority: CN201922348613.5 20191224
- Main IPC: F21K9/238
- IPC: F21K9/238 ; F21K9/90 ; F21V29/77 ; F21Y115/10

Abstract:
Examples of the disclosure disclose a heat dissipation structure for a lamp, which includes: a base cup, a supporting top cover, a base cup heat dissipation housing, and a top cover heat dissipation housing. The base cup and the supporting top cover are both made of metal, the supporting top cover is detachably connected to the base cup by interference fitting; and the base cup heat dissipation housing and the top cover heat dissipation housing are both made of thermally conductive plastic. In the present disclosure, the supporting top cover and the base cup are connected to each other by interference fitting to form an internal heat conduction structure; the heat is transferred to the outside by the top cover heat dissipation housing corresponding to the supporting top cover and the base cup corresponding to the base cup.
Public/Granted literature
- US20210190275A1 HEAT DISSIPATION STRUCTURE FOR LAMP AND LED LAMP Public/Granted day:2021-06-24
Information query