Invention Grant
- Patent Title: HVAC systems and methods with multiple-path expansion device subsystems
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Application No.: US16595533Application Date: 2019-10-08
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Publication No.: US11255582B2Publication Date: 2022-02-22
- Inventor: Wenqian Liu
- Applicant: Lennox Industries Inc.
- Applicant Address: US TX Richardson
- Assignee: Lennox Industries Inc.
- Current Assignee: Lennox Industries Inc.
- Current Assignee Address: US TX Richardson
- Agency: Hubbard Johnston, PLLC
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B39/00 ; F24F11/30 ; F25B41/20 ; F25B41/40 ; F25B39/04 ; F25B41/385

Abstract:
A method for cooling air in an HVAC system includes moving refrigerant through a closed refrigeration circuit having, inter alia, an expansion device subsystem, which includes a full-load pathway and at least one partial-load pathway and a flow selector for directing refrigerant flow from the condenser to either the partial-load pathway or the full-load pathway. The method also involves directing refrigerant flow from the condenser to the full-load pathway when the refrigerant pressure is greater than or equal to a first preselected activation pressure and stepping down a refrigerant pressure with a set orifice and directing refrigerant flow from the condenser to the partial-load pathway when the refrigerant pressure is less than a second preselected activation pressure and stepping down a refrigerant pressure with a variable expansion device configured for partial loads. Refrigerant is delivered from the full-load pathway or partial-load pathway to the evaporator.
Public/Granted literature
- US20200033030A1 HVAC Systems and Methods with Multiple-Path Expansion Device Subsystems Public/Granted day:2020-01-30
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