A sensor for the detection of lead includes a substrate, a working electrode formed on a surface of the substrate, a counter electrode formed on the surface of the substrate, a dielectric layer covering a portion of the working electrode and counter electrode and defining an aperture exposing other portions of the working electrode and counter electrode. The working electrode includes a metalized film with working surface and a monolayer (or bilayer) of bismuth deposited on the working surface by underpotential deposition.