Invention Grant
- Patent Title: Lead frame and sensor device using same
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Application No.: US16774189Application Date: 2020-01-28
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Publication No.: US11255869B2Publication Date: 2022-02-22
- Inventor: Koki Yamamoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Agent Richard C Turner
- Priority: JPJP2019-077483 20190416
- Main IPC: H01L23/495
- IPC: H01L23/495 ; G01P3/44

Abstract:
Provided are a lead frame that allows changing of arrangement of contact electrodes, and a sensor device using the same. The lead frame is configured such that, when conductive wires having contact electrodes are developed on a plane, the conductive wires extend from the contact electrodes so as not to cross each other and are turned at first turned portions. The inner two wires are defined as a first group, and the remaining wires are defined as a second group. Each first group conductive wire has a second and a third turned portion turned in the opposite direction, the first group conductive wires are bent in opposite to the second group conductive wires, using, as an axis of a bending portion.
Public/Granted literature
- US20200333372A1 LEAD FRAME AND SENSOR DEVICE USING SAME Public/Granted day:2020-10-22
Information query
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