An electrical bonding test device, including a test system circuit configured to generate a current pulse for ground bonding testing of subject units, a first test system connector configured to provide an electrical connection between a first unit connector shell of a first unit of the subject units and the test system circuit and to pass the current pulse to the first unit connector shell during the ground bonding testing, and a second test system connector configured to provide an electrical connection between a second unit connector shell of a second unit of the subject units and a first node of the test system circuit. The test system circuit is further configured to provide an indication indicating whether a bonding path through the subject units is a conductive path having a resistance below a resistance threshold.