Invention Grant
- Patent Title: Semiconductor device and method of making
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Application No.: US16787976Application Date: 2020-02-11
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Publication No.: US11256114B2Publication Date: 2022-02-22
- Inventor: Yi-Chen Chen , Ming Chyi Liu , Shih-Wei Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: G02B6/13
- IPC: G02B6/13 ; G02B6/12 ; G02F1/025 ; F21V8/00

Abstract:
A semiconductor device is provided. The semiconductor device includes a silicon nitride waveguide in a first dielectric layer over a substrate. The semiconductor device includes a semiconductor waveguide in a second dielectric layer over the first dielectric layer. The first dielectric layer including the silicon nitride waveguide is between the second dielectric layer including the semiconductor waveguide and the substrate.
Public/Granted literature
- US20210247633A1 SEMICONDUCTOR DEVICE AND METHOD OF MAKING Public/Granted day:2021-08-12
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