Invention Grant
- Patent Title: Method for correcting processing condition and substrate processing system
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Application No.: US16535484Application Date: 2019-08-08
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Publication No.: US11257206B2Publication Date: 2022-02-22
- Inventor: Takuya Mori
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-153396 20180817
- Main IPC: G06T7/00
- IPC: G06T7/00 ; H01L21/67 ; G01N21/95 ; G01N21/956

Abstract:
A method for correcting a processing condition includes imaging a substrate using an imaging device before start and after completion of a series of processings; specifying a processing apparatus estimated as having an abnormality, based on an imaging result and information on the processing apparatus; performing the unit processing in the processing apparatus on an inspection substrate under a predetermined processing condition, and imaging the inspection substrate by the imaging device before and after performing the unit processing; determining presence/absence of an actual abnormality in the processing apparatus specified in the specifying; and correcting, with respect to the processing apparatus determined as having the actual abnormality in the determining presence/absence of an actual abnormality, the processing condition of the unit processing in the processing apparatus based on the imaging result in the imaging the inspection substrate for determining an abnormality.
Public/Granted literature
- US20200058121A1 METHOD FOR CORRECTING PROCESSING CONDITION AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2020-02-20
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