Invention Grant
- Patent Title: Soundproof structure and opening structure
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Application No.: US16283042Application Date: 2019-02-22
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Publication No.: US11257473B2Publication Date: 2022-02-22
- Inventor: Shogo Yamazoe , Shinya Hakuta , Akihiko Ohtsu
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2016-163007 20160823,JPJP2017-095509 20170512
- Main IPC: G10K11/162
- IPC: G10K11/162 ; G10K11/16

Abstract:
There are provided a soundproof structure and an opening structure capable of suppressing degradation of sound absorbing characteristics due to resonance vibration. A micro perforated plate having a plurality of through-holes passing therethrough in the thickness direction and a first frame body, which is disposed in contact with one surface of the micro perforated plate and has a plurality of hole portions, are provided. The opening diameter of the hole portion of the first frame body is larger than the opening diameter of the through-hole of the micro perforated plate. The opening ratio of the hole portion of the first frame body is larger than the opening ratio of the through-hole of the micro perforated plate. The resonance frequency of the micro perforated plate in contact with the first frame body is higher than the audible range.
Public/Granted literature
- US20190228756A1 SOUNDPROOF STRUCTURE AND OPENING STRUCTURE Public/Granted day:2019-07-25
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