Invention Grant
- Patent Title: Substrate gripping mechanism, substrate transfer device, and substrate processing system
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Application No.: US16223841Application Date: 2018-12-18
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Publication No.: US11257707B2Publication Date: 2022-02-22
- Inventor: Masahiro Dogome , Keisuke Kondoh
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: JPJP2018-000681 20180105
- Main IPC: H01L21/687
- IPC: H01L21/687 ; B25J9/16 ; H01L21/67 ; B65G47/90 ; H01L21/677 ; B25J18/04
Abstract:
A substrate gripping mechanism, for gripping a substrate between a fixed clamp portion to be engaged with an edge portion of a substrate and a movable clamp portion configured to reciprocate with respect to the fixed clamp portion by a reciprocating driving unit, includes an interlocking member configured to move together with the movable clamp portion, and a first sensor and a second sensor, each having a detection region and configured to detect whether or not the interlocking member exists in the detection region. The interlocking member has a first to a fourth portion connected in a reciprocating direction of the movable clamp portion. The first to the fourth portion have shapes to make detection results thereof by the first sensor and the second sensor different from each other.
Public/Granted literature
- US20190214289A1 SUBSTRATE GRIPPING MECHANISM, SUBSTRATE TRANSFER DEVICE, AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2019-07-11
Information query
IPC分类:
