A semiconductor device includes: a first semiconductor substrate and a logic circuit provided on the first semiconductor substrate; a memory cell provided above the logic circuit and a second semiconductor substrate provided above the memory cell; a bonding pad provided above the second semiconductor substrate and electrically connected to the logic circuit; and a wiring provided above the second semiconductor substrate. The wiring is electrically connected to the memory cell, and includes at least one of a data signal line, a control voltage line, and a power supply line.