Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16884167Application Date: 2020-05-27
-
Publication No.: US11257813B2Publication Date: 2022-02-22
- Inventor: Kenta Suganuma
- Applicant: ROHM Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: ROHM Co., Ltd.
- Current Assignee: ROHM Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2019-099505 20190528
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H02M1/34 ; H01L49/02 ; H01L23/522

Abstract:
A semiconductor device includes: semiconductor layer having surface and rear surface; insulating film formed on the surface; first and second surface electrode layers formed on the insulating film; rear electrode layer formed on the rear surface; active region set in region of the surface covered with the first surface electrode layer; capacitor region set in region of the surface covered with the second surface electrode layer; first trench formed in the active region; first insulating film formed on inner surface of the first trench; first embedded electrode embedded in the first trench and controlling ON/OFF of current flowing between the first surface electrode layer and the rear electrode layer; second trench formed in the capacitor region; second insulating film formed on inner surface of the second trench; and second embedded electrode embedded in the second trench and electrically connected to the first surface electrode layer.
Public/Granted literature
- US20200381421A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-12-03
Information query
IPC分类: