Invention Grant
- Patent Title: Cable connection structure, endoscope, and method of manufacturing cable connection structure
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Application No.: US17224292Application Date: 2021-04-07
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Publication No.: US11258222B2Publication Date: 2022-02-22
- Inventor: Takanori Sekido
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01R12/50
- IPC: H01R12/50 ; H05K1/11 ; H01R43/02 ; A61B1/00 ; H01R12/53

Abstract:
A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.
Public/Granted literature
- US20210226396A1 CABLE CONNECTION STRUCTURE, ENDOSCOPE, AND METHOD OF MANUFACTURING CABLE CONNECTION STRUCTURE Public/Granted day:2021-07-22
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