Invention Grant
- Patent Title: Thermal based wireless configuration
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Application No.: US17208081Application Date: 2021-03-22
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Publication No.: US11258504B2Publication Date: 2022-02-22
- Inventor: Daniel C. Chisu , Si Chen
- Applicant: Motorola Mobility LLC
- Applicant Address: US IL Chicago
- Assignee: Motorola Mobility LLC
- Current Assignee: Motorola Mobility LLC
- Current Assignee Address: US IL Chicago
- Agency: FIG. 1 Patents
- Main IPC: H04B7/08
- IPC: H04B7/08 ; H04B7/06

Abstract:
Techniques for thermal based wireless configuration are described and may be implemented via a wireless device to adapt antennas and/or wireless beams of the wireless device based on a thermal condition. Generally, the described techniques enable the wireless device to compensate for thermal conditions that occur at different antennas, such as high temperatures that may degrade antenna and device performance.
Public/Granted literature
- US20210281312A1 Thermal Based Wireless Configuration Public/Granted day:2021-09-09
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