Invention Grant
- Patent Title: Printed circuit board structure for solid state drives
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Application No.: US17085749Application Date: 2020-10-30
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Publication No.: US11259403B1Publication Date: 2022-02-22
- Inventor: Wenwei Wang , Xiaofang Chen , Danyang Qiao , Sonny Mirador
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board (PCB) structure is provided for a solid state drive. In an embodiment, a solid state drive includes top and bottom layers, multiple intermediate layers and a ground cage. Each of top and bottom layers includes a plurality of components for operation of the solid state drive. The multiple intermediate layers enable electrical signals to pass between components on the top and bottom layers, one of the multiple intermediate layers including a power plane having a high voltage relative to each of the other planes. The ground cage shields signal traces on the same layer as the power plane and planes in adjacent layers from noise generated by the power plane.
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