Invention Grant
- Patent Title: Rigid-flexible printed circuit board and electronic component module
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Application No.: US16811146Application Date: 2020-03-06
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Publication No.: US11259404B2Publication Date: 2022-02-22
- Inventor: Jun Oh Hwang , Jae Ho Shin , Yun Je Ji
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0001422 20200106
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/00 ; H05K9/00
Abstract:
A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.
Public/Granted literature
- US20210212201A1 RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE Public/Granted day:2021-07-08
Information query
