Invention Grant
- Patent Title: Multilayer housings
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Application No.: US16074175Application Date: 2016-10-03
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Publication No.: US11259423B2Publication Date: 2022-02-22
- Inventor: Kuan-Ting Wu , Kevin Voss , Ai-Tsung Li , Wei Kuang Chu , Wei-Chung Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch PLLC
- International Application: PCT/US2016/055130 WO 20161003
- International Announcement: WO2018/067104 WO 20180412
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K5/02 ; B32B3/26 ; B32B7/14 ; G06F1/16 ; H05K5/00

Abstract:
Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.
Public/Granted literature
- US20210136938A1 MULTILAYER HOUSINGS Public/Granted day:2021-05-06
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