Invention Grant
- Patent Title: Metal powder for metal additive manufacturing and molded object produced using said metal powder
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Application No.: US16348566Application Date: 2018-06-21
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Publication No.: US11260451B2Publication Date: 2022-03-01
- Inventor: Yoshitaka Shibuya , Kenji Sato
- Applicant: JX Nippon Mining & Metals Corporation
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Howson & Howson LLP
- Priority: JPJP2017-190218 20170929
- International Application: PCT/JP2018/023634 WO 20180621
- International Announcement: WO2019/064745 WO 20190404
- Main IPC: B22F1/02
- IPC: B22F1/02 ; B22F1/00 ; B33Y70/00 ; C23C14/16 ; C23C14/22 ; C23C18/16 ; C23C18/31 ; B33Y80/00

Abstract:
A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.
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