Invention Grant
- Patent Title: Controlling heat sources based on representative temperatures
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Application No.: US15948438Application Date: 2018-04-09
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Publication No.: US11260598B2Publication Date: 2022-03-01
- Inventor: Ismael Fernandez Aymerich , Lluis Abello Rosello , Sergio Puigardeu Aramendia
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y50/02 ; B33Y30/00 ; B29C64/165 ; B28B1/00 ; B28B17/00 ; B29C64/153 ; B29C64/188 ; B29C64/295 ; G05D23/19 ; B33Y10/00 ; B22F10/20 ; B22F10/30

Abstract:
In an example, a method includes measuring a temperature of a plurality of regions of a layer of build material in an additive manufacturing apparatus to provide initial temperature values. For each of a plurality of regions which comprise build material which is intended to fuse, an average temperature value of a plurality of neighbouring regions may be determined and the initial temperature values may be replaced with the average temperature value. Based on the replacement temperature values, a representative temperature of an area of the layer of build material may be determined and a heat source may be controlled based on the representative temperature.
Public/Granted literature
- US20190308372A1 CONTROLLING HEAT SOURCES BASED ON REPRESENTATIVE TEMPERATURES Public/Granted day:2019-10-10
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