Invention Grant
- Patent Title: Tape lamination machine scrap collection assembly
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Application No.: US17027962Application Date: 2020-09-22
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Publication No.: US11260640B2Publication Date: 2022-03-01
- Inventor: Nicholas Boroughs , Duncan Kochhar-Lindgren , Cody Casteneda , Nicholas Gacek , Amanda Kotchon
- Applicant: Fives Machining Systems, Inc.
- Applicant Address: US WI Fond du Lac
- Assignee: Fives Machining Systems, Inc.
- Current Assignee: Fives Machining Systems, Inc.
- Current Assignee Address: US WI Fond du Lac
- Agency: Reising Ethington P.C.
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/00 ; B29C70/00 ; B29C70/38 ; B32B38/04 ; B32B38/18 ; B29C70/54

Abstract:
A scrap collection assembly for a tape lamination head that applies a plurality of composite tape segments includes a crack-off assembly with a scrap crack-off redirect roller configured to engage one or more composite tape segments and one or more scrap portions; a secondary crack-off roller configured to engage one or more composite tape segments and one or more scrap portions; a pivot that connects the crack-off assembly to the tape lamination head, wherein the secondary crack-off roller selectively moves about the pivot to change a direction of composite tape movement; and a conveyor that receives the scrap portion(s) from the secondary crack-off roller.
Public/Granted literature
- US20210245486A1 TAPE LAMINATION MACHINE SCRAP COLLECTION ASSEMBLY Public/Granted day:2021-08-12
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