- Patent Title: Apparatus for reticulation of adhesive and methods of use thereof
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Application No.: US16409428Application Date: 2019-05-10
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Publication No.: US11260641B2Publication Date: 2022-03-01
- Inventor: Kevin C. Razon , Andrew Y. Wong , Nicholas F. Martin , Jason H. Thomas
- Applicant: AMERICAN HONDA MOTOR CO., INC.
- Applicant Address: US CA Torrance
- Assignee: AMERICAN HONDA MOTOR CO., INC.
- Current Assignee: AMERICAN HONDA MOTOR CO., INC.
- Current Assignee Address: US CA Torrance
- Agency: Arent Fox LLP
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/00 ; B32B38/18 ; B32B37/04 ; B32B37/06 ; B32B41/00 ; G10K11/168 ; B32B38/04 ; B32B37/10 ; B32B37/12 ; F02K1/82

Abstract:
A method, apparatus, and system for reticulating an adhesive on a workpiece. The workpiece may be perforated with a plurality of passages that extend through a first side to a second side. To reticulate an adhesive on the first side of a workpiece, a flow of heated fluid is provided through a nozzle. The nozzle provides the fluid at a first pressure to a first group of the perforations. Once the temperature at the first side of the workpiece reaches a specified range, the fluid pressure may be increased or otherwise set in order to clear the perforations by forcing the adhesive out of or away from each of the perforations. Temperature of the adhesive, pressure within the nozzle, and/or light passage through the perforations may be monitored for logical control or quality assurance.
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