The present disclosure provides systems and methods for depositing a metal layer adjacent to or on a substrate. Substrates may comprise, for example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, oxides thereof, nitrides thereof, sulfides thereof, or any combination thereof. A substrate may be a steel substrate. A metal layer may be deposited via, for example, roll coating, vapor deposition, slurry deposition, or electrochemical deposition.