Invention Grant
- Patent Title: Aluminum plating at low temperature with high efficiency
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Application No.: US15884006Application Date: 2018-01-30
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Publication No.: US11261533B2Publication Date: 2022-03-01
- Inventor: David W. Groechel , Gang Peng , Robert Mikkola
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C25D3/44
- IPC: C25D3/44 ; C25D5/00 ; C25D5/18 ; C25D3/66 ; C25D17/02 ; C25D21/10

Abstract:
The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.
Public/Granted literature
- US20180230616A1 ALUMINUM PLATING AT LOW TEMPERATURE WITH HIGH EFFICIENCY Public/Granted day:2018-08-16
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