Invention Grant
- Patent Title: Heat dissipation module and heat dissipation method thereof
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Application No.: US16364193Application Date: 2019-03-26
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Publication No.: US11262110B2Publication Date: 2022-03-01
- Inventor: Chih-Teng Shen , Liang-Fang Wan
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW108101555 20190115
- Main IPC: F25B21/02
- IPC: F25B21/02 ; F25B21/04

Abstract:
A heat dissipation module and a heat dissipation method thereof are provided. A cold side of a thermoelectric cooler is disposed on a heat conducting member. A processing circuit controls a voltage control circuit to provide an output voltage to the thermoelectric cooler according to a temperature sensing signal generated by a temperature sensor sensing a temperature of the heat conducting member, so as to adjust a temperature of the cold side of the thermoelectric cooler to dissipate heat for a heat source.
Public/Granted literature
- US20200224933A1 HEAT DISSIPATION MODULE AND HEAT DISSIPATION METHOD THEREOF Public/Granted day:2020-07-16
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