Provided is a wafer prober. The wafer probing stage of the wafer prober includes: a lower plate; a plurality of lifting pillars mounted on an upper surface of the lower plate; and an upper plate mounted on upper ends of the plurality of lifting pillars, wherein the plurality of lifting pillars are located between the upper plate and the lower plate and ends of the lifting pillars are configured to lift up and down in a vertical direction, and wherein a height and a slope of the upper plate are adjusted according to heights of the lifting pillars. The wafer probing stage can adjust a height of the chuck arranged on the upper plate and a slope or flatness of the chuck by adjusting a height of each lifting pillar according to a weight applied to each lifting pillar.