Invention Grant
- Patent Title: Multilayer metal stack heater
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Application No.: US16900714Application Date: 2020-06-12
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Publication No.: US11262603B2Publication Date: 2022-03-01
- Inventor: Yi Zhang , Chia-Te Chou , Sanna Leena Mäkelä
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB London
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB London
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G02F1/01
- IPC: G02F1/01

Abstract:
A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.
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