Invention Grant
- Patent Title: Backlight module and manufacturing method thereof
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Application No.: US16711553Application Date: 2019-12-12
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Publication No.: US11262616B2Publication Date: 2022-03-01
- Inventor: Weikang Hou
- Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: CN201911110224.7 20191114
- Main IPC: G02F1/13357
- IPC: G02F1/13357

Abstract:
A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a frame, a thin-film thermoelectric device set, a first heat conductive layer, a light emitting diode (LED) light, a bulk thermoelectric device set, and a second heat conductive layer. The manufacturing method for backlight module includes a device preparing step, a thin-film thermoelectric device set mounting step, a first heat conductive layer preparing step, an LED light mounting step, a bulk thermoelectric device set mounting step, and a bulk thermoelectric device set mounting step. The technical effect of the invention is to realize the heat dissipation and the recovery and utilization function of the waste heat.
Public/Granted literature
- US20210149250A1 BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-05-20
Information query
IPC分类: