Invention Grant
- Patent Title: Photosensitive resin composition, photosensitive dry film, and pattern forming process
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Application No.: US16411472Application Date: 2019-05-14
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Publication No.: US11262655B2Publication Date: 2022-03-01
- Inventor: Hitoshi Maruyama , Hideto Kato , Michihiro Sugo
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JPJP2018-095370 20180517
- Main IPC: C08G77/60
- IPC: C08G77/60 ; G03F7/075 ; G03F7/004 ; G03F7/038 ; G03F7/40 ; H01L23/00 ; C08G77/00 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38
Abstract:
A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
Public/Granted literature
- US20190354014A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS Public/Granted day:2019-11-21
Information query
