Invention Grant
- Patent Title: Photomask, photolithography system and manufacturing process
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Application No.: US16860080Application Date: 2020-04-28
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Publication No.: US11262658B2Publication Date: 2022-03-01
- Inventor: Che-Yuan Chang , Chih-Chiang Tu , Ming-Ho Tsai , Ching-Hung Lai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/36 ; G03F1/70 ; G03F1/82
Abstract:
A photomask includes a transparent substrate and a shielding pattern disposed on the transparent substrate. The shielding pattern includes shielding island structures. The shielding island structures are separated from and spaced apart from one another by dividing lanes. The dividing lanes expose the underlying transparent substrate. The photomask is configured for a light of a wavelength, and the dividing lanes reduce or hinder a transmission of the light of the wavelength.
Public/Granted literature
- US20210333705A1 PHOTOMASK, PHOTOLITHOGRAPHY SYSTEM AND MANUFACTURING PROCESS Public/Granted day:2021-10-28
Information query
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