- Patent Title: Ultra thin information handling system housing with hybrid assembly
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Application No.: US16898759Application Date: 2020-06-11
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Publication No.: US11262804B2Publication Date: 2022-03-01
- Inventor: Deeder M. Aurongzeb , Brandon J. Brocklesby
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Zagorin Cave LLP
- Agent Robert W. Holland
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An information handling system housing provides a reduced overall material thickness by forming a planar housing piece of a first metal, such as aluminum, with an interior surface having channels of reduced thickness and laser sintering a pattern in the channel with a second material, such as a pattern of interconnected hexagons formed by lines of steel. Locally formed shapes of components disposed in the housing, such as battery shape, provide room for the components with improved stiffness of the housing to meet structural constraints.
Public/Granted literature
- US20210389806A1 ULTRA THIN INFORMATION HANDLING SYSTEM HOUSING WITH HYBRID ASSEMBLY Public/Granted day:2021-12-16
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