Invention Grant
- Patent Title: Electronic device
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Application No.: US17013875Application Date: 2020-09-08
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Publication No.: US11262819B2Publication Date: 2022-03-01
- Inventor: Chih-Yao Kuo , Chin-Kai Sun , Chung-Chiao Tan , Tung-Hsin Yeh
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H01L23/467

Abstract:
An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.
Public/Granted literature
- US20210216119A1 ELECTRONIC DEVICE Public/Granted day:2021-07-15
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