Invention Grant
- Patent Title: Ultrasound fingerprint sensing and sensor fabrication
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Application No.: US15968420Application Date: 2018-05-01
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Publication No.: US11263422B2Publication Date: 2022-03-01
- Inventor: Yi He , Bo Pi
- Applicant: Shenzhen Goodix Technology Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen Goodix Technology Co., Ltd.
- Current Assignee: Shenzhen Goodix Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Perkins Coie LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01S15/89 ; G01S7/52 ; B06B1/06 ; H01L41/113 ; H01L41/332 ; H01L41/338 ; B06B1/02 ; H01L41/312 ; H01L41/18

Abstract:
Disclosed are systems, devices and methods for providing fingerprint sensors based on ultrasound imaging techniques in electronic devices and fabrication techniques for producing ultrasound-based fingerprint sensors. In some aspects, an ultrasound fingerprint sensor device includes an intermediate layer coupled to a base chip including an integrated circuit having conducive contacts at a surface of the base chip, the intermediate layer including an insulation layer formed on the base chip and a corresponding array of channeling electrode structures coupled to the conductive contacts and passing through the insulation layer, in which the channeling electrodes terminate at or above a top surface of the insulation layer to provide bottom electrodes; a plurality of ultrasonic transducer elements including an acoustic transducer material coupled to the bottom electrodes; and a plurality of top electrodes positioned on the ultrasonic transducer elements.
Public/Granted literature
- US20180314871A1 ULTRASOUND FINGERPRINT SENSING AND SENSOR FABRICATION Public/Granted day:2018-11-01
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